ENEE 416: Integrated Circuit (IC) Fabrication Lab (Fall 2011)

Group Activity 9

Assigned: 11/17/11

Due: 11/30/11, 5 p.m.

Group: Ronald Curley, Thomas McCormack, and Matthew Phipps

Topic: LPCVD vs PECVD

Address the concepts and differences between Low Pressure Chemical Vapor Deposition and Pressure Enhanced Chemical Vapor Deposition. Describe their respective advantages and disadvantages and applications. Prepare a 15-minute PowerPoint presentation, a 3-4 page report using font Times New Roman 11 ( including figures and references), and 4 problems with solutions. Please e-mail the PowerPoint presentation, the report (in pdf or Word), problems (in pdf or Word) and solutions (in pdf or Word) to Prof. Ghodssi and Mike Fan.