Reliability Science for Cost-Effective, Safe, and Reliable Electronic Products and Systems

Wednesday, May 1, 2019
8:00 a.m.
Prince George's Room, Adele Stamp Student Union, University of Maryland, College Park, MD 20742

On Wednesday, May 1, 2019, as part of the 125th Anniversary of the Clark School of Engineering, the Center for Advanced Life Cycle Engineering (CALCE) will hold a symposium on Reliability Science for Cost-Effective, Safe, Reliable Electronics Products and Systems at the University of Maryland in College Park.

As we rely more on electronics in our everyday life, we depend on their reliability and safety.  Reliability science focuses on how one designs, tests, and sustains products, systems and systems-of-systems. This symposium consists of 10 unique presentations from CALCE experts, based CALCE’s research and practical work with over 500 companies over the past 30 years. The issues cover supply chain issues, design, testing, prediction and new technologies.  This symposium will give you an insight into what the leaders in reliability are concerned with and working on.

Wednesday, May 1, 2019

8:00 am Why We Cannot Trust Suppliers  - Prof. Michael Pecht

8:45 am Strategic Sustainment: Never Mistake a Clear View for a Short Distance - Prof. Peter Sandborn

9:30 am Testing for Realistic Environments: What happens when multiple stress types act simultaneously ? - Prof. Abhijit Dasgupta

10:30 am Can Your Electronics Take the Heat? - Prof. Patrick McCluskey

11:15 am Novel Device Structures and Materials for Wide and ULTRA-Wide Bandgap Semiconductor Power Electronics - Prof. Aris Christou

12:00 pm Lunch

1:00 pm Integrating Domain Knowledge into Machine Learning Algorithms for Improved Product Health Management - Dr. Michael Azarian

1:45 pm Testing and Measurements Challenges for Future Electronic Packaging Materials and Components - Prof. Bongtae Han

2:30 pm MEMS Inertial Sensor Design and Reliability - Dr. Jianglong Zhang- Analog Devices

3:30 pm Simulation Based Life and Risk Assessment for Electronic Hardware - Dr. Michael Osterman

4:15 pm What to Expect When You Procure "Obsolete and Hard to Find" Products from Open Market? Dr. Diganta Das


Symposium Registration (code RS Symposium $250 for each attendee, $200 for CALCE member/US government attendees, no cost to invited University of Maryland personnel/students)

University of Maryland personnel or students interested in attending, please email Dr. Michael Osterman at :


About Presenters:

Dr. Michael Azarian'sprimary research focus is the detection, prediction and analysis of failures in electronic components and assemblies. He has developed techniques for predictive maintenance through analysis of big data in complex systems ranging from aircraft to manufacturing equipment to electrical circuits. He has also developed techniques for non-destructive early detection of degradation in a number of electronic or electromechanical components and circuit elements, including interconnects, motor bearings, and electrical coils. He has over 150 publications on electronics reliability and packaging, prognostics and health management, and tribology, and holds 5 U.S. patents. Dr. Azarian is chair of the SAE G-19A Test Laboratory Standards Development Committee which is responsible for the AS6171 family of standards on detection of counterfeit electrical, electronic, and electromechanical parts. He is also vice chair of the working group responsible for the IEEE 1624 standard on organizational reliability capability of suppliers of electronic products.

Professor Aris Christoupreviously served as the Chair of the Department of Materials and Nuclear Engineering. He currently conducts research in compound semiconductor materials and process science, radiation effects in materials and devices, manufacturing science, and reliability. From 2000-2003, Dr. Christou was the Director of the NSF Center COEDIP, the Center of OptoElectronic Devices, Interconnects and Packaging. Prior to his appointments at the University of Maryland, he was a Professor of Electronic Materials at Rutgers University, and research scientist at the Naval Research Laboratory.

Dr. Diganta Dasis a member of the research staff at the Center for Advanced Life Cycle Engineering. His expertise is in reliability, environmental and operational ratings of electronic parts, uprating, electronic part reprocessing, counterfeit electronics, technology trends in the electronic parts and parts selection and management methodologies. He performs benchmarking processes and organizations of electronics companies for parts selection and management and reliability practices. Dr. Das has published more than 75 articles on these subjects, and presented his research at international conferences and workshops. He had been the technical editor for two IEEE standards and is currently vice chair of the standards group of IEEE Reliability Society. He is a sub group leader for the SAE G-19 counterfeit detection standards group.

Professor Abhijit Dasguptais an ASME Fellow and Jeong Kim Professor of Mechanical Engineering at the Mechanical Engineering Department at University of Maryland. He conducts his research on the multi-scale mechanics of engineered, multi-physics material systems, with special emphasis on the micromechanics of constitutive and damage behavior for material systems used for heterogeneous integration in microsystems. Prof. Dasgupta applies these principles for developing effective virtual qualification tools, for optimizing manufacturing process windows, for real-time health monitoring and for devising quantitative accelerated testing strategies used in qualification and quality assurance of complex electronic, electromechanical and structural systems. He has published over 250 journal articles and conference papers, presented over 35 short courses and workshops nationally and internationally and developed undergraduate/graduate college curriculum, and served industry as an expert consultant, on these topics. He has served on the editorial boards of three different international journals, organized several national and international conferences, and received seven international awards for his contributions in materials engineering research and education. He is currently on the ASME Segment Leadership Team for Design Manufacturing and Materials Segment and is leading the Reliability Team in the pan-industry Heterogeneous Integration Roadmap.

Dr. Bongtae Hanis Keystone Professor of Engineering and APT Chair of the Mechanical Engineering Department of the University of Maryland; and is currently directing the LOMSS (Laboratory for Optomechanics and Micro/nano Semiconductor/Photonics Systems) of CALCE (Center for Advanced Life Cycle Engineering). Dr. Han received the IBM Excellence Award for Outstanding Technical Achievements in 1994. He was a recipient of the 2002 Society for Experimental Mechanics (SEM) Brewer Award for his contributions to development of photomechanics tools used in semiconductor packaging. Most recently, he was named the 2016 American Society of Mechanical Engineering (ASME) Mechanics Award winner in Electronic and Photonic Packaging Division for his contributions to structural mechanics of electronic systems. His publication awards include (1) the Year 2004 Best Paper Award of the IEEE Transactions on Components and Packaging Technologies, (2) the Gold Award (best paper in the Analysis and Simulation session) of the 1st Samsung Technical Conference in 2004 and (3) the Year 2015 Best Paper Award of the 16th International Conference on Electronic Packaging Technology (ICEPT 2015). His contributions to an innovative 1,500-face lumen LED luminaire, jointly developed with GE, have been recognized in a Press Release (Oct. 21, 2010,, The Wall Street Journal). He served as an Associate Technical Editor for Experimental Mechanics, from 1999 to 2001, and Journal of Electronic Packaging, Transaction of the ASME from 2003 to 2012. He is currently serving as an Associate Editor for Microelectronics Reliability. He was elected a Fellow of the SEM and the ASME in 2006 and 2007, respectively.

Prof. Patrick McCluskeyis a Professor of Mechanical Engineering at the University of Maryland, College Park. He is associated with the CALCE center where he is the principal investigator for projects related to packaging and reliability of electronic components for high power and high temperature environments. He is the author or co-author of over 100 technical articles on his research, and the co-author of three books. He has served as the technical program chair for several symposia and conferences in these research areas. He is a fellow of IMAPS and is a member of ASME, IEEE, and SAE.

Dr. Michael Osterman is a senior research scientist and director of the CALCE Electronics Products and Systems Consortium. He has published extensively on solder interconnect reliability and modeling for electronic products. He also leads the development of the CALCE Simulation Assisted Reliability Assessment software. He is a senior member of IEEE and a member of SMTA and ASME.



Professor Michael Pecht(25,000+ citations, 70+ H-Index) has a BS in Physics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, an SAE Fellow and an IMAPS Fellow. He served as editor-in-chief of IEEE Access for six years, as editor-in-chief of IEEE Transactions on Reliability for nine years, and editor-in-chief of Microelectronics Reliability for sixteen years. He has also served on three U.S. National Academy of Science studies, two US Congressional investigations in automotive safety, and as an expert to the U.S. FDA. He is the Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He is also a Chair Professor. He has written more than twenty books on product reliability, development, use and supply chain management.  He has also written a series of books of the electronics industry in China, Korea, Japan and India. He has written over 700 technical articles and 10 patents. In 2015 he was awarded the IEEE Components, Packaging, and Manufacturing Award for visionary leadership in the development of physics-of-failure-based and prognostics-based approaches to electronics reliability. He was also awarded the Chinese Academy of Sciences President's International Fellowship. In 2010, he received the IEEE Exceptional Technical Achievement Award for his innovations in the area of prognostics and systems health management.  In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society’s Lifetime Achievement Award.

Peter Sandbornis a Professor in the CALCE Electronic Products and Systems Center and the Director of the Maryland Technology Enterprise Institute at the University of Maryland. Dr. Sandborn's group develops life-cycle cost models and business case support for long field life systems. This work includes: obsolescence forecasting algorithms, strategic design refresh planning, lifetime buy quantity optimization, return on investment models for maintenance planning and outcome-based contract design and optimization. Dr. Sandborn is the developer of the MOCA refresh planning tool. Dr. Sandborn is an Associate Editor of the IEEE Transactions on Electronics Packaging Manufacturing and a member of the Board of Directors of the PHM Society. He is the author of over 200 technical publications and several books on electronic packaging and electronic systems cost analysis. He was the winner of the 2004 SOLE Proceedings, the 2006 Eugene L. Grant, and the 2017 ASME Kos Ishii-Toshiba awards. He has a B.S. degree in engineering physics from the University of Colorado, Boulder, in 1982, and the M.S. degree in electrical science and Ph.D. degree in electrical engineering, both from the University of Michigan, Ann Arbor, in 1983 and 1987, respectively. He is a Fellow of the IEEE and the ASME.

Dr. Jianglong Zhang joined Analog Devices Inc. in 2007 and currently holds the position of the staff MEMS design engineer. He is the MEMS designer for several high volume automotive inertial sensor products and currently working on the designs of MEMS inertial sensors for a wide range of applications such as industrial, automotive, consumer and health care. He received a B.S. degree in Mechanical engineering in 1998 from Tsinghua University in Beijing, China and M.S. and Ph.D. in Mechanical engineering in 2000 and 2002, respectively, from University of Colorado at Boulder. He holds more than 10 issued and pending patents.

Please contact Dr. Osterman for more information on how to participate and attend.




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