Event
Ph.D. Dissertation Defense: Zhiyuan Yang
Thursday, April 5, 2018
2:30 p.m.-4:30 p.m.
AVW 2328
Maria Hoo
301 405 3681
mch@umd.edu
ANNOUNCEMENT: Ph.D. Dissertation Defense
Name: Zhiyuan Yang
Committee
Professor Ankur Srivastava, Chair
Professor Donald Yeung
Professor Joseph JaJa
Professor Manoj Franklin
Professor Bruce L. Golden, Dean’s Representative
Date/time: Thursday, April 5th, 2018 at 2:30 pm - 4:30 pm.
Place: AVW 2328
Title: Thermal, Power Delivery, and Reliability Management for 3D ICs
Abstract: Three-dimensional (3D) integration technology is promising to continuously improve the performance of electronic devices by vertically stacking multiple active layers and connecting them with Through-silicon-vias (TSVs). Meanwhile, the thermal and power integrity problems are exacerbated in 3D ICs due to the large power flux. The TSV structure will also bring new reliability challenges. The dissertation will investigate solutions to these challenges at both design-time and run-time. During the design stage, we propose physical design methods to co-optimize the placement of gates, signal TSVs, the design of power delivery network as well as the micro-fluidic cooling system. For run-time management, we propose a new learning-based dynamic management technique which can be used to adjust the working mode of 3D CPUs to achieve better system performance and reliability.