Credits: 3
This course is geared towards developing a unified understanding of three critical aspects of VLSI: technology, design and tools. Popular methods of fabricating VLSI chips will be investigated, along with typical design practices and design tools. Topics will include photo lithography, layouts, low power and high performance design methods, fabrication randomness, ASICs, FPGAs and popular design methodologies. New directions in the field, such as 3D ICs, flash memory technology, carbonnanotubes, fin-fets and advanced cooling techniques, will be considered.
Description
Prerequisite: Completion of the following with a C- or better: (ENEE303 or ENEE304); and ENEE350. Students who have taken courses with comparable content may contact the department; or by permission of instructor.This course is geared towards developing a unified understanding of three critical aspects of VLSI: technology, design and tools. Popular methods of fabricating VLSI chips will be investigated, along with typical design practices and design tools. Topics will include photo lithography, layouts, low power and high performance design methods, fabrication randomness, ASICs, FPGAs and popular design methodologies. New directions in the field, such as 3D ICs, flash memory technology, carbonnanotubes, fin-fets and advanced cooling techniques, will be considered.
Semesters Offered
Spring 2022, Spring 2023, Spring 2024, Spring 2025Learning Objectives
- Intricacies of digital design methods for VLSI technology
- Understanding of models of power and performance
- Understanding the methods of optimization of power and performance
- Developing an understanding of how to compose digital circuits with both logic and memory
Topics Covered
- VLSI Fabrication Technology
- Basics of MOS Transistors
- Stick diagrams and CMOS layout.
- Resistance, capacitance, and performance optimization.
- Low Power and Low Temperature Issues
- VLSI circuit modules: adders, shifters etc
- Dynamic Logic
- Memory circuits
- FPGA Circuits
- New technologies: Finfets, CNTs, 3D ICs
- CAD Tools: Could include SPICE, Cadence, MAGIC etc.