Event
27th IEEE Electronic Design Process Symposium (Day 1 of 2)
Wednesday, September 30, 2020
11:00 a.m.-2:30 p.m.
Online presentation--registration required
Gang Qu
gangqu@umd.edu
http://www.ieee-edps.com/program1.html
Gang Qu is helping to organize the 27th IEEE Electronic Design Process Symposium (EDPS). Presentations in EDPS are invitation-only and majority of the speakers are from industry.
Please join us for the 27th Electronic Design Process Symposium (EDPS) which will be held virtually on September 30th and October 1st. EDPS continues to serve as a leading forum for thought leaders of the design community, where industry leaders discuss state-of-the-art improvements to the electronic design processes and CAD methodologies, emphasizing trends and new paradigms, rather than on the functions of the individual tools themselves.
This year our focus is on Smart Design and Manufacturing (CAD/Test/Manufacturing tools). We will look at new developments in systems approach to design and manufacturing, and work using system-level techniques to reach HVM in a shorter amount of time. New techniques such as Quantum Computing, Heterogeneous Integration, Advanced Packaging, and Machine Learning for improving design processes as well as the tools that support these, will be presented.
Due to the global pandemic, the event will be virtual event and will provide a forum for EDA, design, wafer fab and packaging/test experts to address both design and manufacturing challenges. Attendees can participate in the conference for free this year. To register go to https://edps2020.eventbrite.com. For a list of speakers and abstracts visit http://www.ieee-edps.com/program1.html.