Event
ECE Seminar: David Huitink, University of Arkansas-Fayetteville
Wednesday, September 18, 2024
1:00 p.m.
2460 A.V. Williams
Darcy Long
301 405 3114
dlong123@umd.edu
Title: Enabling Reliable Next-Gen Power Electronics through Integrated Thermal Management
Abstract: As the drive for power densification puts stress on conventional packaging and thermal management approaches in power electronics, the need for creative solutions becomes more evident. A number of commercial power packages have moved toward double sided cooling for enabling higher power densities, and recent literature reflects moves toward greater levels of thermal integration. This talk will explore the research contributions pioneering advancements in custom, high-density power modules through the integration of novel thermal management technologies. Emphasizing the critical role of thermal management in enhancing the efficiency and reliability of high-voltage power modules, the research showcases a variety of innovative solutions. These include nonmetallic additively manufactured impingement coolers, direct jet impingement cooling using dielectric fluids, and the integration of dielectric fluid microchannels within source bussing terminals. Such advancements are critical to the development of heterogeneously integrated, double-sided cooled power modules utilizing wide bandgap technologies used in electric vehicle (EV) power systems. This overview serves to introduce the audience to key elements of the Huitink research program at University of Arkansas that demonstrates significant improvements in power density, thermal management, and overall module performance, so as to set a trajectory for future research engagement in the design and operation of high performance electronics.
Bio: Professor David Huitink joined the faculty in Mechanical Engineering at the University of Arkansas in 2016, prior to which he spent more than 5 years in industry, working in microelectronics technology development and manufacturing at Intel Corporation, where he served as Quality & Reliability Engineering Program Manager for Intel's Custom Foundry Division. There he pioneered the development of advanced methods of predicting reliability of silicon-based flip chip microelectronic packages, as well as developed testing protocols and FEA methods for governing Design for Reliability (DfR) guidance. He managed the foundry customer adoption of 2.5D packaging technology in high performance FPGA processors, along with advancing assembly materials selection for large die and multi-chip packages.
In Academia, Dr. Huitink has built a research program at the intersection of thermal and materials sciences, with primary application in creating solutions for enabling high power dense and reliable electronics. This includes novel material and manufacturing approaches to thermal management of power electronics in electric aircraft and automobiles, as well as development of materials and process methodologies for multifunctional packaging architectures for heat dissipation and structural stability in extending device lifetimes. Working closely with Electrical Engineering collaborators, his team has developed additive manufactured cooling technologies that incorporate design features for passive thermal management with nano-enhanced phase change materials, in addition to EMI shielding jet manifolds for high convective heat transfer.
Prior to his industry experience, Dr. Huitink received his PhD in Mechanical Engineering from Texas A&M University as a NSF Graduate Research Fellow, working on complex nano-scale interactions at material interfaces under chemical and mechanical influence.
